United Innovation's multi-chip solution, realizing the LED-on-PCB with sophisticated
 flip-chip packaging technology - more efficient and lower production cost

Uninnov's multip-chip technology has been recognized to be one of the best technologies for not only the lighting applications, but also for the next generation's backlight modules for TFT-LCD, TV, and other display devices.

The main advantage of using LED-on-PCB technology for backlight application is that the size of target application is reduced substantially thanks to the thin layer of the LED chip packaged directly onto the LED substrate. For detail technical information about United Innovation's multi-chip application, please send your request to This e-mail address is being protected from spambots. You need JavaScript enabled to view it .